Wednesday 4
Posters - Lubricant Additives

› 18:30 - 20:00 (1h30)
Quantum Chemical Molecular Dynamics Simulations of Chemical Mechanical Polishing Processes for Silicon Wafer by SiO2 Abrasive Grain
Kentaro Kawaguchi  1, @  , Higuchi Yuji  1, @  , Ozawa Nobuki  1, @  , Momoji Kubo  1, @  
1 : Fracture and Reliability Research Institute, Tohoku University
6-6-11, Aoba, Aramaki, Aoba-ku, Sendai 980-8579 -  Japan
Subject : : poster
Topics : Posters - Lubricant Additives
Keywords : Chemical mechanical polishing ; Silicon ; SiO2 abrasive grain
PDF version :  PDF version
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